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An activator, An activator solution, a slurry system and a polishing process for chemical mechanical polishing metal layers
An activator, An activator solution, a slurry system and a polishing process for chemical mechanical polishing metal layers
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机译:用于化学机械抛光金属层的活化剂,活化剂溶液,浆料系统和抛光工艺
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摘要
This invention relates to a CMP slurry system for use in semiconductor manufacturing. The slurry system comprises two parts. The first part is a generic dispersion that only contains an abrasive and, optionally, a surfactant and a stabilizing agent. The generic dispersion can be used for polishing metals as well as interlayer dielectrics (ILD). The second part is a novel activator solution comprising at least two components selected from the group consisting of: an oxidizer, acids, amines, chelating agents, fluorine-containing compounds, corrosion inhibitors, buffering agents, surfactants, biological agents and mixtures thereof.
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