首页> 外国专利> Fabrication method of an epilayer structure for InGaAsP/InP ridge waveguide phase modulator with a high phase modulation efficiency

Fabrication method of an epilayer structure for InGaAsP/InP ridge waveguide phase modulator with a high phase modulation efficiency

机译:具有高相位调制效率的InGaAsP / InP脊形波导相位调制器的外延层结构的制造方法

摘要

PURPOSE: A method for fabricating epi-layer of an InGaAsP/InP ridge waveguide phase modulator having high phase modulation efficiency is provided to reduce the manufacturing cost and enhance the reliability by using a semiconductor including chemical compounds of a third and a fourth group. CONSTITUTION: A first cladding layer(20) of N-InP is formed on an N¬+-Inp substrate(10). A first waveguide layer(30) of n-InGaAsP and a second waveguide layer(40) of p-InGaAsP are formed on the first cladding layer sequentially. A second cladding layer(50) of P-InP and a third cladding layer(60) of P-InP are sequentially formed on the second waveguide layer. A p+-InGaAs electrode layer(70) is formed on the third cladding layer.
机译:目的:提供一种用于制造具有高相位调制效率的InGaAsP / InP脊形波导相位调制器的外延层的方法,以通过使用包括第三和第四族化合物的半导体来降低制造成本并提高可靠性。组成:N-InP的第一包层(20)形成在N + -Inp衬底(10)上。在第一包层上依次形成n-InGaAsP的第一波导层(30)和p-InGaAsP的第二波导层(40)。在第二波导层上依次形成P-InP的第二包层(50)和P-InP的第三包层(60)。在第三包层上形成p + -InGaAs电极层(70)。

著录项

  • 公开/公告号KR100498259B1

    专利类型

  • 公开/公告日2005-06-29

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20030023458

  • 申请日2003-04-14

  • 分类号G02B6/13;

  • 国家 KR

  • 入库时间 2022-08-21 22:03:40

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