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Ultrafast Semiconductor Photoconductive Switching Device

机译:超快半导体光电导开关器件

摘要

PURPOSE: An ultrafast semiconductor photoconductive switching device and method for manufacturing the same are provided to generate a high speed electrical pulse of pico seconds and femto seconds by making the back surface of a substrate lapped to several tens of micrometers in thickness and by forming a transmission line of a micro strip type in which a suitable quantity of ions are implanted and an amorphous semiconductor is used as a photoconductive layer. CONSTITUTION: A chrome layer of a predetermined thickness and a gold layer of a predetermined thickness are deposited on a semiconductor layer having a predetermined thickness. A photoresist layer is formed on the gold layer. The photoresist layer formed in a region except the center of the gold layer is etched. A gold layer of a predetermined thickness is formed in the region in which the photoresist layer is eliminated. An ion implantation layer is formed in a region in which the photoresist layer formed on the center of the gold layer is eliminated. The semiconductor substrate is lapped to a predetermined thickness to form a chrome layer and a gold layer.
机译:目的:提供一种超快半导体光电导开关装置及其制造方法,其通过将基板的背面研磨至几十微米的厚度并形成透射来产生皮秒和飞秒的高速电脉冲。一条微带型线,其中注入了适量的离子,并且非晶半导体用作光电导层。组成:预定厚度的铬层和预定厚度的金层沉积在具有预定厚度的半导体层上。在金层上形成光刻胶层。蚀刻形成在除了金层的中心之外的区域中的光致抗蚀剂层。在去除了光致抗蚀剂层的区域中形成预定厚度的金层。在其中去除了形成在金层的中心上的光致抗蚀剂层的区域中形成离子注入层。将半导体衬底研磨至预定厚度以形成铬层和金层。

著录项

  • 公开/公告号KR100499522B1

    专利类型

  • 公开/公告日2005-07-07

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20010068332

  • 发明设计人 조신호;

    申请日2001-11-03

  • 分类号H01L29/02;

  • 国家 KR

  • 入库时间 2022-08-21 22:03:41

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