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One time programmable memory device, integrated circuit including the same and method for fabricating thereof

机译:一次性可编程存储器件,包括该可编程存储器件的集成电路及其制造方法

摘要

It discloses with respect to one-time programmable semiconductor integrated circuit and a method of manufacturing the same, including (one time programmable) memory elements, and this. The invention separate no additional photolithography process is used in the group process polysilicon that for forming the floating gate and a control gate of the one-time programmable memory device - producing a metal structure capacitor dielectric-polysilicon structure or a metal-dielectric layer used as a step to implement a one-time programmable memory device. The present invention also provides a way to increase the reliability of the gate oxide film of the one-time programmable memory element and a MOS (MOS) MOS transistor manufacturing a semiconductor integrated circuit including the transistor.
机译:本发明公开了一种一次性可编程半导体集成电路及其制造方法,其包括(一次性可编程)存储元件。本发明在成组工艺多晶硅中不使用额外的光刻工艺,该多晶硅工艺用于形成一次性可编程存储器件的浮置栅极和控制栅极-产生用作金属结构的电容器电介质-​​多晶硅结构或金属-电介质层作为一次性电容器实现一次性可编程存储设备的步骤。本发明还提供一种提高一次性可编程存储元件和制造包括该晶体管的半导体集成电路的MOS(MOS)MOS晶体管的栅极氧化膜的可靠性的方法。

著录项

  • 公开/公告号KR100518577B1

    专利类型

  • 公开/公告日2005-10-04

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20030033346

  • 发明设计人 오희선;구정모;

    申请日2003-05-26

  • 分类号H01L21/8247;

  • 国家 KR

  • 入库时间 2022-08-21 22:03:23

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