METHOD AND APPARATUS FOR CUTTING MONOCRYSTALS, ALIGNING DEVICE AND TESTING METHOD FOR DETERMINING CRYSTAL ORIENTATION

摘要

FIELD: manufacture of semiconductor components and devices.;SUBSTANCE: method for dividing mono-crystal such as GaAs comprises steps of cutting mono-crystal at least by two portions, providing motion of cutting tool (2,3; 8,8w, 8b, 8c) relative to mono-crystal in direction of motion (V); orienting mono-crystal 1 in such a way that to arrange predetermined crystallographic direction (K) in cutting plane (T); selecting angle () between predetermined crystallographic direction (K) and motion direction (V) in such a way that to provide mutual compensation of forces acting upon cutting tool at cutting process in direction normal relative to cutting plane or providing said forces equal to predetermined value.;EFFECT: increased cutting speed, enhanced quality of wafers allowing omit further working operations of them.;16 cl, 12 dwg