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Manufacturing packages with electrical, electronic, micromechanical components or microelectromechanical systems involves providing protective wafer of ceramic, metal or plastic
Manufacturing packages with electrical, electronic, micromechanical components or microelectromechanical systems involves providing protective wafer of ceramic, metal or plastic
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机译:具有电气,电子,微机械组件或微机电系统的制造包装涉及提供陶瓷,金属或塑料保护晶片
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摘要
The method involves applying protection (4) to the front of a wafer (2) with components, thinning the wafer from the rear and separating the components with the associated part of the protection, whereby the protection arrangement provides protection both during thinning and separating and also during proper use of the component and consists of a protective wafer of ceramic, metal or plastic : An independent claim is also included for the following: (a) a package manufactured in accordance with the inventive method.
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