The Direct Bonding of Metals to Ceramics for the Manufactured Microwave Packages

摘要

The present paper refers to the manufacturing of some planar metal-ceramic packages for which metal-ceramic soldering is realised by the metal to metal diffusion mechanism. To fabricate a plane metal-ceramic package, we used ceramic substrates (content of Al_2O_3-99.6%, excellent planarity, and surface roughness under 0.15 microns); gold plated copper (of high conductivity without oxygen) terminals and technological processes specific to the electronic component industry.