Method for manufacturing fragile microelectromechanical system structure of packaged microelectromechanical system components for e.g. laptop, involves coating substrate with plastic material to produce chip packaging

摘要

The method involves applying a protecting layer (30) on fragile microelectromechanical system (MEMS) structures (13) having MEMS chips (12). The protective layer is patterned such that the structures and to-be-protected surface areas are covered with the protecting layer. The chips coated with the protecting layer are attached on a substrate (16). The substrate is coated with a plastic material to produce a chip packaging that completely covers the structures covered with the protecting layer. The protecting layer is selectively removed. An independent claim is also included for a packaged MEMS component comprising a semiconductor chip.