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Retaining ring for a wafer in chemical mechanical polishing has rounded edges and a roughness of at least two microns on the surface touching the polishing cloth
Retaining ring for a wafer in chemical mechanical polishing has rounded edges and a roughness of at least two microns on the surface touching the polishing cloth
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机译:用于化学机械抛光的晶片固定环在接触抛光布的表面上具有倒圆的边缘和至少2微米的粗糙度
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摘要
A retaining ring for a wafer in a chemical-mechanical polishing process comprises a roughness of at least two microns in the surface touching the polishing cloth. The strip edges are rounded with a radius of greater than one mm.
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