Production of a semiconductor wafer comprises rounding the edges of the wafer, mechanically treating the wafer, wet chemically treating the wafer to remove damaged crystal regions and polishing the wafer

摘要

Production of a semiconductor wafer comprises rounding the edges of the wafer; mechanically treating the wafer; wet chemically treating the wafer to remove damaged crystal regions and polishing the wafer. The wet chemical treatment of the wafer is carried out so that no further wet chemical treatment of the wafer is needed. Preferred Features: The wafer is made from silicon. The wet chemical treatment comprises etching the wafer in an acidic solution; rinsing in pure water; and immersing in an aqueous hydrofluoric acid and removing from the acid into a gas chamber containing ozone.