首页> 外国专利> Method for fabricating curved non-communicating structures e.g. on circuit boards, templates etc, involves generating non-communicating structure directly by erosion or reforming

Method for fabricating curved non-communicating structures e.g. on circuit boards, templates etc, involves generating non-communicating structure directly by erosion or reforming

机译:制造弯曲的非连通结构的方法,例如在电路板,模板等上,涉及通过腐蚀或重整直接生成非通信结构

摘要

A method for fabricating non-communicating structures with curved surfaces in which the non-communicating structure is generated directly by erosion and/or reforming by micro-beam (radiation) technique, and/or micro-chisel technique, micro-embossing technique and/or brush technique.
机译:一种用于制造具有弯曲表面的非连通结构的方法,其中,通过微束(辐射)技术和/或微凿技术,微压纹技术和/或腐蚀和/或重整直接产生非连通结构。或刷技术。

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