Directly electroless-plating NI-P thin-film to fabricate magnetic core of integrated inductor for printed circuit board

摘要

Integrated inductor with magnetic core is one of the three significant passive components for PCB (Printed Circuit Board) assembly. In this paper, a novel structure of integrated inductor with Ni-P (low P content) magnetic core deposited on the as-patterned conductive copper lines was fabricated by directly electroless-plating method. Two types of PCB integrated inductor with patterns of rectangle and hexagon winding were designed, respectively. The inductance changes were investigated under the changes of Ni-P plating times and tested frequency. Obvious increasing was observed after the deposition of Ni-P magnetic core. Furthermore, effects of the P content of Ni-P thin-film were also investigated in this paper.