Microsystem on semiconductor substrate, e.g. acceleration sensor, with integrated circuit, micromechanical component has silicon functional layer on substrate near component region, metallization to contact point, preferred interrupt points

摘要

The microsystem has an integrated circuit and at least one micromechanical component with a silicon functional layer (7) electrically connected to it. Structured metallization on the functional layer is connected via contact holes to a buried wiring plane of the component. A silicon layer formed on the substrate forms the functional layer near the component region. A single or multilayer metallization leads at least to a contact point to the relevant connecting element and electrically isolating preferred interrupt points (15) are formed in each connecting element. An independent claim is also included for a method of manufacturing a microsystem.