Processing, especially thinning, wafers with components on one side involves applying coating system to wafer front with separating coating so coating system supports or carries wafer during thinning

摘要

The wafer processing method involves applying a coating system to the front side of the wafer, whereby the coating system has at least one separating coating in contact with the front side of the wafer, and thinning the rear side of the wafer so that the coating system supports or carries the wafer or parts of the wafer during the thinning process. The thinned rear of the wafer can be coated for support during thinning. An independent claim is also included for the following: (a) an arrangement for implementing the inventive method.