首页> 外国专利> Production process for a trench transistor uses high energy implant to form a drain drift region into which the base of the trench extends

Production process for a trench transistor uses high energy implant to form a drain drift region into which the base of the trench extends

机译:沟槽晶体管的生产过程使用高能注入形成漏极漂移区,沟槽的基极延伸到该漏极漂移区中

摘要

A production process for a trench transistor comprises forming an epilayer (11), trench (14), gate dielectric (15) and gate electrode (16) with the transistor in an n-substrate (10) and with a p-body region (20) by the trench and an n-source (13). An n-drift drain (12) is formed by high-energy implant and the base of the trench projects into this region. An independent claim is also included for a trench transistor formed as above.
机译:沟槽晶体管的生产工艺包括:在晶体管位于n衬底(10)中并具有p体区域(p)的情况下,形成外延层(11),沟槽(14),栅极电介质(15)和栅电极(16)。 20)由沟槽和n源(13)组成。通过高能注入形成n型漂移漏极(12),沟槽的底部伸入该区域。对于如上形成的沟槽晶体管也包括独立权利要求。

著录项

  • 公开/公告号DE10361135A1

    专利类型

  • 公开/公告日2005-07-28

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AG;

    申请/专利号DE2003161135

  • 发明设计人 HIRLER FRANZ;PFIRSCH FRANK;

    申请日2003-12-23

  • 分类号H01L21/336;H01L29/78;H01L21/265;

  • 国家 DE

  • 入库时间 2022-08-21 22:00:59

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