Production of a flexible base material used in the production of printed circuit boards involves heating a copper foil to coating temperature over a deviating roller, coating with an epoxy resin lacquer, pressing using a cooling roller

摘要

Production of a flexible base material (13) having a thickness of 30-200 mu m and a length of 50-100 mu m comprises heating a copper foil (6) to a coating temperature over a deviating roller (4), coating with a coating agent (7) made from an epoxy resin lacquer having a thermal hardness which can be initiated by beams, pressing the coated copper foil with a polyester film (8) using a cooling roller (5), placing on a conveyor belt (9) and hardening using UV radiators and coiling the flexible base material produced. Independent claims are also included for the following: (1) Device for carrying out the process; and (2) Flexible base material produced by the above process.