首页> 外国专利> Memory module has secondary memory chips mounted over one of primary memory chips electrically connected to conductive pattern, so that primary memory chip mounted below secondary memory chip is disabled

Memory module has secondary memory chips mounted over one of primary memory chips electrically connected to conductive pattern, so that primary memory chip mounted below secondary memory chip is disabled

机译:存储器模块具有安装在电连接到导电图案的主存储器芯片之一上方的次级存储器芯片,从而禁用了安装在次级存储器芯片下方的主存储器芯片

摘要

The memory chips (107,109) are mounted over one of the memory chips (105) that are mounted on a substrate (101) and electrically connected to an external terminal through a conductive pattern (111), so that the memory chip (105) mounted below the memory chip (109) is disabled.
机译:将存储芯片(107,109)安装在安装在基板(101)上并通过导电图案(111)电连接到外部端子的存储芯片(105)之一上,从而安装存储芯片(105)。低于存储芯片(109)的位置。

著录项

  • 公开/公告号DE102004042042A1

    专利类型

  • 公开/公告日2005-03-31

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号DE20041042042

  • 发明设计人 KIM CHANG-HYUN;KIM KYUNG-HO;

    申请日2004-08-25

  • 分类号G11C5/06;

  • 国家 DE

  • 入库时间 2022-08-21 22:00:42

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