Wafer exposing method for use during semiconductor device fabrication, involves transferring image onto shot areas by irradiating projection light, and scanning die area of wafer by irradiating scanning light

摘要

The method involves transferring an image onto shot areas by irradiating a projection light. Each of the shot areas includes a die area defined on the wafer on which a photoresist film is formed. The wafer is moved with respect to light axis of a scanning light so that the die area adjacent to an edge portion of the wafer is scanned by irradiating the scanning light having a cross-sectional surface of a ribbon shape. Independent claims are also included for the following: (A) a reticle for exposing a wafer to a light (B) an apparatus for exposing a wafer.