Packing for semiconductors has an integrated switching circuit chip with top and bottom sides and a conductor framework in direct contact with a surface on the top/bottom side

摘要

Used for semiconductor packing, an adhesive agent (130) is used on parts of a conductor framework (120) and on parts of a specific surface on an integrated switching circuit chip (ISCC) so as to hold the conductor framework on the ISCC. A majority of input/output contact points (112) are located on the top side of the ISCC. Independent claims are also included for the following: (A) A method for producing semiconductor packing; (B) and for a device for producing semiconductor packing.