The method of manufacturing a electronic conductor plates module with heat dissipation by using a convection cooled printed

摘要

A conduction cooled electronic card module is designed for insertion into a chassis of an electronic device so as to transfer thereto a heat generated by electronic components of the module. The module comprises a circuit card of a convection cooled type, and a thermally conductive frame carrying the circuit card. The circuit card has a front surface carrying at least a part of the electronic components, and a rear surface at least edge areas of which are adapted to be in thermal contact with the chassis. The frame is in thermal contact with the part of the electronic components and with the front surface of the circuit card at least at edge areas thereof, so as to conduct heat generated by the electronic components, via the edge areas of the front surface to the edge areas of the rear surface of the circuit card.