Method of manufacturing heat dissipation plate for a semiconductor module , semiconductor module using the heat dissipation plate and the heat dissipation plate

摘要

There is provided a semiconductor module which, at the time of soldering insulating substrates of different shapes to a radiator plate, makes the management of a curve formed on the radiator plate before soldering easy, prevents the appearance of a crack in solder, and narrows a gap between the radiator plate and a cooling fin. When insulating substrates (1 and 2) of different shapes are soldered to a radiator plate (3), a third concave curve (11) is formed in advance on an insulating substrate (1 and 2) side of the radiator plate (3). The third curve (11) is determined by adding a second concave curve (7) which is expected at the time of actually soldering the insulating substrates (1 and 2) of different shapes to the radiator plate (3) to a first concave curve (6) obtained by moving upside down a convex curve which appears at the time of soldering the insulating substrates (1 and 2) of different shapes to a flat radiator plate (3). A bottom (11a) of the third curve (11) is positioned under the large insulating substrate (2) and a curvature of a portion for which the distance between the bottom (11a) and a reference point (5a) of the radiator plate (3) is longer is made smaller than a curvature of a portion for which the distance between the bottom (11a) and a reference point (5b) of the radiator plate (3) is shorter.