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Cutting of plastic functional films applied on hard substrates using an ultra-sonic cutting device which cuts the film without damaging the underlying substrate, notably for window applications
Cutting of plastic functional films applied on hard substrates using an ultra-sonic cutting device which cuts the film without damaging the underlying substrate, notably for window applications
The cutting of a functional film of plastic material, in particular a protective film applied on a hard substrate (6), such as a glass plate, is realized using an ultra-sonic cutting device of which the characteristics and parameters are selected such that the cut may only be effected in the thickness of the functional film whilst leaving the underlying substrate intact. An independent claim is also included for the ultra-sonic cutting apparatus used for the cutting operation.
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