首页> 外国专利> Cutting of plastic functional films applied on hard substrates using an ultra-sonic cutting device which cuts the film without damaging the underlying substrate, notably for window applications

Cutting of plastic functional films applied on hard substrates using an ultra-sonic cutting device which cuts the film without damaging the underlying substrate, notably for window applications

机译:使用超声波切割设备切割应用于硬质基材上的塑料功能薄膜,该设备可在不损坏下方基材的情况下切割薄膜,特别是用于窗户应用

摘要

The cutting of a functional film of plastic material, in particular a protective film applied on a hard substrate (6), such as a glass plate, is realized using an ultra-sonic cutting device of which the characteristics and parameters are selected such that the cut may only be effected in the thickness of the functional film whilst leaving the underlying substrate intact. An independent claim is also included for the ultra-sonic cutting apparatus used for the cutting operation.
机译:使用超声波切割装置来实现塑料材料功能膜的切割,特别是涂覆在诸如玻璃板的硬质基材(6)上的保护膜,该超声波切割装置的特征和参数选择为切割只能在功能膜的厚度上进行,而使下面的基板完好无损。还包括用于切割操作的超声波切割设备的独立权利要求。

著录项

  • 公开/公告号FR2857614A1

    专利类型

  • 公开/公告日2005-01-21

    原文格式PDF

  • 申请/专利权人 SAINT-GOBAIN GLASS FRANCE;

    申请/专利号FR20030050342

  • 发明设计人 GARREC RONAN;

    申请日2003-07-17

  • 分类号B26F3/00;B02C19/18;B60J1/02;B60K35/00;

  • 国家 FR

  • 入库时间 2022-08-21 21:58:24

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