首页> 外国专利> METHOD FOR FORMING SURFACE OF ALUMINUM OR ALUMINUM ALLOY SUPPRESSING ELECTRIFICATION, AND ALUMINUM OR ALUMINUM ALLOY MEMBER SUPPRESSING ELECTRIFICATION

METHOD FOR FORMING SURFACE OF ALUMINUM OR ALUMINUM ALLOY SUPPRESSING ELECTRIFICATION, AND ALUMINUM OR ALUMINUM ALLOY MEMBER SUPPRESSING ELECTRIFICATION

机译:抑制电沉积的铝或铝的表面形成方法以及抑制电沉积的铝或铝构件

摘要

PROBLEM TO BE SOLVED: To provide a method of forming an aluminum surface of suppressing electrification for solving trouble caused by static electricity generated on the surface of aluminum used in a process of producing a semiconductor or a liquid crystal display.;SOLUTION: For suppressing the contact/peeling electrification causing the generation of static electricity in the surface of aluminum, a rough surface having rough ruggedness with the average surface roughness (Ra) of ≥5 microns is formed on the surface of aluminum, and a contact area is reduced, so as to suppress electrification quantity. Further, electrically conductive alumite whose electric conductivity is improved is formed on an alumite film as a nonconductor, so as to control the electric resistance value of the film to a semiconductor region, thus electric charges are mildly removed by the moderate electric conductivity of the film. As a result, dielectric breakdown caused by sparks is suppressed.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:提供一种形成铝的抑制带电的方法,以解决由在制造半导体或液晶显示器的过程中使用的铝表面上产生的静电所引起的麻烦。接触/剥离带电会在铝的表面产生静电,在铝的表面形成具有粗糙不平整度的粗糙表面,其平均表面粗糙度(Ra)为5微米,并且接触面积减小,从而抑制带电量。另外,在作为非导体的氧化铝膜上形成导电性提高的导电性氧化铝膜,以控制该膜对半导体区域的电阻值,通过该膜的适度的导电性温和地除去电荷。 。结果,抑制了由火花引起的电介质击穿。;版权所有:(C)2007,JPO&INPIT

著录项

  • 公开/公告号JP2006291259A

    专利类型

  • 公开/公告日2006-10-26

    原文格式PDF

  • 申请/专利权人 KUMABO METAL:KK;

    申请/专利号JP20050111135

  • 申请日2005-04-07

  • 分类号C23F1/36;C23C18/31;C23C18/32;C25D11/04;C25D11/16;

  • 国家 JP

  • 入库时间 2022-08-21 21:56:55

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