METHOD FOR FORMING OBJECT TO BE PLATED, METHOD FOR FORMING ELECTROPLATING FILM, OBJECT TO BE PLATED AND ELECTROPLATING FILM

摘要

PROBLEM TO BE SOLVED: To provide a method for forming the object to be plated in which parts on which metal is not deposited are partially present in electroless plating, to provide a method for forming an electroplating film utilizing the same, to provide the object to be plated, and to provide an electroplating film.;SOLUTION: A synthetic resin in a liquid state is mixed with a curing agent of curing the synthetic resin and a water-soluble substance dissolved in water, and the mixture is molded and solidified, so as to form a base material. Then, at least a partial region in the face to be plated to be subjected to plating treatment in the base material is polished, and the water-soluble substance occluded in the synthetic resin is exposed to the face to be plated in the base material. The base material is dipped into an electroless plating liquid, and, as the water-soluble substance exposed to the face to be plated is dissolved in the electroless plating liquid, an electroless plating film is formed on the region other than the part corresponding to the water-soluble substance exposed to the face to be plated. Further, the electroless plating film is subjected to electroplating treatment, thus an electroplating film having vacancies is formed.;COPYRIGHT: (C)2006,JPO&NCIPI