NICKEL PLATING SOLUTION, ELECTROPLATING METHOD USING THE SAME, AND CHIP COMPONENT WITH NICKEL-PLATED FILM FORMED BY THE ELECTROPLATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a nickel plating solution in which an organic complexing agent is not used, which has a pH within the neutral range where ceramics and protection coat layers thereof are hardly eroded and with which the conventional productivity can be obtained, and to provide an electroplating method using the nickel plating solution.;SOLUTION: The nickel plating solution is characterized in that nickel sulfamate, a depolarizer and a stress controlling agent are contained and the pH is adjusted to be within the neutral range of 5.3-6.4 by using ammonia. Further, a pH buffering agent is incorporated into the nickel plating solution to obtain a stable nickel plating solution in which the precipitate of nickel hydroxide hardly occurs although it has a pH within the neutral range. Nickel plating is applied to an object to be plated such as a chip component by using equipment similar to the conventional one and the nickel plating solution and setting plating conditions as before.;COPYRIGHT: (C)2009,JPO&INPIT