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Fundamental Studies on the Copper and Nickel Electroplating Methods of Stress Analysis : Effects of the Ground Plating on the Proper Stress

机译：对铜和镍电镀的基础研究应力分析方法：电镀对适当应力的影响

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Masaichiro SEIKA; Yasuo NAGASE; Kikuo HOSONO; Noriaki TAKETANI;
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年度 1982
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2. The influence of pulse plating frequency and duty cycle on the microstructure and stress state of electroplated copper films [J] . Marro James B., Darroudi Taghi, Okoro Chukwudi A., Thin Solid Films . 2017,第JANa1期

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3. Effects of chloride, bromide and iodide ions on internal stress in films deposited during high speed nickel electroplating from a nickel sulfamate bath [J] . Tsuru Y., Foulkes FR., Nomura M. Journal of Applied Electrochemistry . 2000,第2期

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4. Sensitivity of a stress measurement method for copper electroplating using the effects of stress concentration [C] . S.J. Kwon, T. Kinji, K. Ogawa, 11th International Conference on Computational Methods and Experimental Measurements (CMEM 2003) 2003 Halkidiki, Greece . 2003

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5. Electrodeposition of copper-cobalt alloys and copper-nickel alloys and pulse plating of copper-cobalt alloys [D] . Wang, Shuisheng. 1989

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Fundamental Studies on the Copper and Nickel Electroplating Methods of Stress Analysis : Effects of the Ground Plating on the Proper Stress

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