首页> 外国专利> CO-BASE ALLOY HAVING EXCELLENT EROSION RESISTANCE TO MOLTEN LEAD-FREE SOLDER AND LEAD-FREE SOLDERING EQUIPMENT MEMBER COMPOSED OF THE CO-BASE ALLOY

CO-BASE ALLOY HAVING EXCELLENT EROSION RESISTANCE TO MOLTEN LEAD-FREE SOLDER AND LEAD-FREE SOLDERING EQUIPMENT MEMBER COMPOSED OF THE CO-BASE ALLOY

机译:具有良好耐蚀性的Co-Base合金,对组成Co-Base合金的无铅无铅焊料和无铅焊料设备成员

摘要

PROBLEM TO BE SOLVED: To provide a Co-base alloy having excellent erosion resistance to lead-free solder, more particularly to Sn-Ag-based lead-free solder and a lead-free soldering equipment member composed of the Co-base alloy.;SOLUTION: The Co-base alloy has a composition containing 20.0% to 35.0% Cr, 3.0 to 15.0% W, 0.1 to 25.0% Fe, 0.01 to 1.20% C, 0.5 to 2.0% Mn, 0.1 to 2.0% Si, further containing one or two kinds among (a) 1.0 to 24.0% Ni and (b) one or two or more kinds of 0.01 to 0.15% La and 0.01 to 0.15% Ce, (c) 0.001 to 0.05% Mg or two or more kinds among (a) to (c) and consisting of the balance inevitable impurities. The lead-free soldering equipment member is composed of the Co-base alloy.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:解决的问题:提供一种对无铅焊料具有更优异的耐腐蚀性的Co基合金,尤其是对Sn-Ag基无铅焊料和由Co基合金组成的无铅焊接设备部件。 ;解决方案:钴基合金的成分包括20.0%至35.0%的Cr,3.0至15.0%的W,0.1至25.0%的铁,0.01至1.20%的C,0.5至2.0%的Mn,0.1至2.0%的Si,以及含有(a)1.0至24.0%的Ni和(b)0.01至0.15%的La和0.01至0.15%的一种或两种以上的一种或两种,(c)0.001至0.05%的Mg或两种以上的一种或两种(a)〜(c)中,由余量不可避免的杂质构成。无铅焊接设备部件由钴基合金组成。;版权所有:(C)2006,JPO&NCIPI

著录项

  • 公开/公告号JP2006257541A

    专利类型

  • 公开/公告日2006-09-28

    原文格式PDF

  • 申请/专利权人 MITSUBISHI MATERIALS CORP;

    申请/专利号JP20050204505

  • 发明设计人 SAITO SADAO;SUGAWARA KATSUO;MIHASHI AKIRA;

    申请日2005-07-13

  • 分类号C22C19/07;C22F1/10;C22F1/00;C23C2/00;

  • 国家 JP

  • 入库时间 2022-08-21 21:55:23

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