METHOD FOR FORMING THIN FILM CONDUCTOR LAYER OF METALLIC PARTICULATE SINTERED COMPACT TYPE, AND METHODS FOR FORMING METALLIC WIRING AND METALLIC THIN FILM BY APPLYING THE METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a metallic particulate sintered compact exhibiting a good electric conductivity by setting a heat treatment temperature to be used within a range not exceeding at least 200°C at the time of forming a metallic particulate sintered compact layer while a metallic particulate coating layer applied on a substrate is subjected to low-temperature thermal sintering.;SOLUTION: After the coating molecules on a surface are removed from the metallic particulates having a surface coating molecule layer included in a coating layer, the metallic particulates are subjected to low-temperature thermal sintering, and at this time, the metallic particulates are irradiated with energy rays from the surface of the coating layer, and thereafter, the metallic particulates are subjected to a heat treatment at a low temperature (below 15°C), and thereby the removal of the coating molecules of the surface is accelerated and the sintering itself of the metallic particulates is rapidly progressed by such low-temperature heating and the metallic particulate sintered compact exhibiting the good electric conductivity is formed.;COPYRIGHT: (C)2006,JPO&NCIPI