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METHOD OF PREPARING SILICON DIOXIDE LAYER BY HIGH-TEMPERATURE OXIDATION ON SUBSTRATE HAVING GERMANIUM OR SILICON-GERMANIUM ALLOY ON AT LEAST ITS SURFACE
METHOD OF PREPARING SILICON DIOXIDE LAYER BY HIGH-TEMPERATURE OXIDATION ON SUBSTRATE HAVING GERMANIUM OR SILICON-GERMANIUM ALLOY ON AT LEAST ITS SURFACE
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机译:至少表面具有锗或硅锗合金的基质上高温氧化制备二氧化硅层的方法
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摘要
PPROBLEM TO BE SOLVED: To provide a method of forming an SiOSB2/SBfilm, in which germanium is not mixed by a high-temperature oxidation on the surface of an SiGe substrate. PSOLUTION: The method is for preparing the silicon oxide layer by the high-temperature oxidation on the substrate expressed by the formula SiSB1-x/SBGeSBx/SB, wherein x is larger than 0 and smaller than 1. The method comprises (a) a step where at least one additional layer 13 where the thickness is hSBy/SB, and the general Formula is SiSB1-y/SBGeSBy/SB(wherein y is larger than 0 and smaller than x) is coated on the substrate 12 expressed by the Formula SiSB1-x/SBGeSBx/SB; and (b) a step where the high-temperature oxidation is performed on the layer 13 where the general Formula is SiSB1-y/SBGeSBy/SB, and a step where the layer 13 is completely or partially converted into a silicon oxide SiOSB2/SBlayer 14 by the continuous steps (a) and (b). PCOPYRIGHT: (C)2006,JPO&NCIPI
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解决方案:该方法用于通过高温氧化在由Si 1-x SB> Ge x SB>表示的基板上制备氧化硅层。大于0且小于1。该方法包括(a)步骤,其中至少一个另外的层13的厚度为h y SB>,并且通式为Si 1-y SB> Ge y SB>(其中y大于0且小于x)涂覆在由式Si 1-x SB> Ge 表示的基板12上x SB>; (b)在通式为Si 1-y SB> Ge y SB>的层13上进行高温氧化的步骤,以及该层的步骤通过连续步骤(a)和(b),将图13所示的氧化硅层完全或部分转化为氧化硅SiO 2 SB>层14。