The GaAs thin-shaped die/di which has copper back metal structure

摘要

In the thin-shaped GaAs baseplate (310) providing copper back metal layer (340), using former plastic packaging technology, the packaging try to be able do the GaAs baseplate. Because the GaAs baseplate can be made thin under 2 mils (approximately 50 microns) by providing copper back metal layer in the GaAs baseplate, it can lighten the problem of thermal radiation, it is possible at the same time to apply soft solder technology to the semiconductor die/di. It is possible to decrease cost largely, by making the packaging of the semiconductor die/di to the plastic package possible.