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Semiconductor device lifetime estimation method and reliability simulation method

机译:半导体器件寿命估计方法和可靠性仿真方法

摘要

A hot carrier lifetime of a MOS transistor is estimated, depending on model formulas: 1/tau=1/tauSUB0/SUB+1/tauSUBb/SUB; tauSUBb/SUB∝1SUBsub/SUBSUP-mb/SUP.ISUBd/SUBSUPmb-2/SUP.exp(a/|VSUBbs/SUB|), where tau denotes a lifetime, ISUBsub /SUBdenotes a substrate current, ISUBd /SUBdenotes a drain current, VSUBbs /SUBdenotes a substrate voltage, tauSUB0 /SUBdenotes a lifetime at the time the substrate voltage VSUBbs/SUB=0, tauSUBb /SUBdenotes a quantity representing deterioration of a lifetime at the time the substrate voltage |VSUBbs/SUB|0, and mb and 'a' are model parameters. Furthermore, a parameter Age representing a cumulative stress quantity is calculated depending on model formulas: Age=AgeSUB0/SUB+AgeSUBb/SUB; AgeSUBb/SUB=∫1/HSUBb/SUB[ISUBsub/SUBSUPmb/SUP.ISUBd/SUBSUP2-m/SUP].exp(-a/|VSUBbs/SUB|)dt, where t denotes time, HSUBb /SUBis a model parameter, AgeSUB0 /SUBdenotes a parameter representing a cumulative stress quantity at the time the substrate voltage VSUBbs/SUB=0, and AgeSUBbs /SUBdenotes a quantity representing an increase of the cumulative stress quantity at the time the substrate voltage at |VSUBbs/SUB|0. Thereby, a lifetime in actual use is determined with accuracy even when a substrate voltage is applied, and circuit characteristic degradation is simulated with high accuracy.
机译:根据以下模型公式估算MOS晶体管的热载流子寿命:1 / tau = 1 / tau 0 + 1 / tau b ; tau b ∝1 sub -mb .I d mb-2 .exp (a / | V bs |),其中tau表示寿命,I sub 表示衬底电流,I d 表示漏极电流, V bs 表示基板电压,tau 0 表示基板电压V bs = 0时的寿命,tau b < / SUB>表示代表衬底电压| V bs |> 0时寿命恶化的数量,mb和'a'是模型参数。此外,根据模型公式计算代表累积应力量的参数Age:Age = Age 0 + Age b ;年龄 b =∫1/ H b [I sub mb .I d 2-m ]。exp(-a / | V bs |)dt,其中t表示时间,H b 是模型参数, Age 0 表示表示衬底电压V bs = 0时的累积应力量的参数,Age bs 表示表示基板电压V bs = 0时的累积应力量。衬底电压为| V bs |> 0时的累积应力量增加。由此,即使在施加基板电压的情况下,也能够准确地确定实际使用中的寿命,并且能够高精度地模拟电路特性的劣化。

著录项

  • 公开/公告号JP3820172B2

    专利类型

  • 公开/公告日2006-09-13

    原文格式PDF

  • 申请/专利权人 松下電器産業株式会社;

    申请/专利号JP20020086792

  • 发明设计人 小池 典雄;

    申请日2002-03-26

  • 分类号H01L29/78;H01L21/336;H01L21;H01L21/02;H01L29;

  • 国家 JP

  • 入库时间 2022-08-21 21:52:03

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