HIGHLY TRANSPARENT POLY(AMIC ACID-IMIDE) COPOLYMER AND POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION CONTAINING THE SAME, AND CURED FILM OF THE COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a positive-type photosensitive composition comprising a highly transparent poly(amic acid-imide) copolymer and a photosensitizer, and to provide a method for producing practically useful polyimide film fine pattern having a combination of low dielectric constant, low coefficient of thermal expansion, high glass transition temperature and adequate toughness obtained by subjecting the composition to fine processing under light exposure/development followed by imidation.;SOLUTION: The photosensitive resin composition is such that a diazonaphthoquinone-based photosensitizer is incorporated in film of a poly(amic acid-imide) copolymer made from a polyimide precursor(polyamic acid) of the formula(1) (wherein, A is a bivalent aromatic or aliphatic group; B is a tetravalent aromatic or aliphatic group; and X is 0.1-0.95) and a polyimide. The method for producing the polyimide film fine pattern comprises using the photosensitive resin composition, subjecting the composition to light exposure/alkali development followed by heating or reaction with a cyclodehydrating reagent.;COPYRIGHT: (C)2006,JPO&NCIPI