Leaving the part which the said insulating material exposes in metal membrane formation manner on the insulating material, continuity manner of the through hole where

摘要

PROBLEM TO BE SOLVED: To surely and easily form a metallic film with high reliability without using Ag paste and to conduct a through-hole in a method for forming the metallic film and a method for producing a contact probe. ;SOLUTION: A metallic film 17 for etching previously provided on an insulating material 14 while leaving a part where the insulating material is exposed, is vaporized at least partly by plasma etching and a part of the vaporized metal is deposited on a part where the insulating material is exposed to form a plating substrate film 18. Subsequently, the plating substrate is electroplated with a metal to form a metallic plating film 19.;COPYRIGHT: (C)1999,JPO