USE OF ENHANCED TURBOMOLECULAR PUMP FOR GAPFILL DEPOSITION USING HIGH FLOWS OF LOW-MASS FLUENT GAS

摘要

High flows of low-mass fluent gases are used in an HDP-CVD process for gapfill deposition of a silicon oxide film. An enhanced turbomolecular pump that provides a large compression ratio for such low-mass fluent gases permits pressures to be maintained at relatively low levels in a substrate processing chamber, thereby improving the gapfill characteristics.