Method and device for the high-precision machining of the surface of an object, especially for polishing and lapping semiconductor substrates

摘要

The aim the invention is to machine the surface of objects using a universal device as economically as possible and in a significantly reduced amount of time, even in the event of process variations, material non-homogeneities etc., with high reproducible precision. The this end, the pressure distribution on the surface which is decisive for the machining process is determined by temporarily weighting the object to be machined—said object being fixed to a receiving surface (17)—and measuring the thus occurring change in position of the receiving surface (17) by means of actuator-sensor elements (180 from the calculated pressure distribution. The invention can generally be applied to the surface machining of objects beyond the lapping or polishing of the above-mentioned semiconductor substrates.