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Substrate engineering for optimum CMOS device performance

机译:基板工程可实现最佳CMOS器件性能

摘要

An integrated semiconductor structure having different types of complementary metal oxide semiconductor devices (CMOS), i.e., PFETs and NFETs, located atop a semiconductor substrate, wherein each CMOS device is fabricated such that the current flow for each device is optimal is provided. Specifically, the structure includes a semiconductor substrate that has a (110) surface orientation and a notch pointing in a 001 direction of current flow; and at least one PFET and at least one NFET located on the semiconductor substrate. The at least one PFET has a current flow in a 110 direction and the at least one NFET has a current flow in a 100 direction. The 110 direction is perpendicular to the 100 direction. A method of fabricating such as integrated semiconductor structure is also provided.
机译:位于半导体衬底顶上的具有不同类型的互补金属氧化物半导体器件(CMOS),即PFET和NFET的集成半导体结构,其中,制造每个CMOS器件,使得每个器件的电流最佳。具体地,该结构包括半导体衬底,该半导体衬底具有(110)表面取向和指向电流的<001>方向的切口;至少一个PFET和至少一个NFET位于半导体衬底上。至少一个PFET具有在<110>方向上的电流,并且至少一个NFET具有在<100>方向上的电流。 <110>方向垂直于<100>方向。还提供了一种制造诸如集成半导体结构的方法。

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