首页> 外国专利> Dielectric structures having high dielectric constants, methods of forming the dielectric structures, non-volatile semiconductor memory devices having the dielectric structures and methods of manufacturing the non-volatile semiconductor memory devices

Dielectric structures having high dielectric constants, methods of forming the dielectric structures, non-volatile semiconductor memory devices having the dielectric structures and methods of manufacturing the non-volatile semiconductor memory devices

机译:具有高介电常数的介电结构,形成介电结构的方法,具有介电结构的非易失性半导体存储器件以及制造非易失性半导体存储器件的方法

摘要

In a method of manufacturing a dielectric structure, after a tunnel oxide layer pattern is formed on a substrate, a floating gate is formed on the tunnel oxide layer. After a first dielectric layer pattern including a metal silicon oxide and a second dielectric layer pattern including a metal silicon oxynitride are formed, a control gate is formed on the dielectric structure. Since the dielectric structure includes at least one metal silicon oxide layer and at least one metal silicon oxynitride layer, the dielectric structure may have a high dielectric constant and a good thermal resistance. A non-volatile semiconductor memory device including the dielectric structure may have good electrical characteristics such as a large capacitance and a low leakage current.
机译:在制造介电结构的方法中,在衬底上形成隧道氧化物层图案之后,在隧道氧化物层上形成浮栅。在形成包括金属氧化硅的第一介电层图案和包括金属氮氧化硅的第二介电层图案之后,在介电结构上形成控制栅极。由于介电结构包括至少一层金属氧化硅层和至少一层金属氮氧化硅层,所以介电结构可以具有高介电常数和良好的耐热性。包括电介质结构的非易失性半导体存储器件可以具有良好的电特性,诸如大电容和低泄漏电流。

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