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Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
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机译:微电子器件,在微电子器件中形成通孔的方法以及封装微电子器件的方法
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摘要
Microelectronic devices, methods for packaging microelectronic devices, and methods for forming vias and conductive interconnects in microfeature workpieces and dies are disclosed herein. In one embodiment, a method includes forming a bond-pad on a die having an integrated circuit, the bond-pad being electrically coupled to the integrated circuit. A conductive line is then formed on the die, the conductive line having a first end portion attached to the bond-pad and a second end portion spaced apart from the bond-pad. The method can further include forming a via or passage through the die, the bond-pad, and the first end portion of the conductive line, and depositing an electrically conductive material in at least a portion of the passage to form a conductive interconnect extending at least generally through the microelectronic device.
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