High density integrated circuit having multiple chips and employing a ball grid array (BGA) and method for making same

摘要

High density integrated circuits and more particularly to a high density integrated circuit incorporating a multiplicity of functional chips arranged on a substrate comprised of a plurality of dielectric and conductive layers which interface the semiconductor dies with a ball gate array (BGA) arranged on the underside of the substrate and wherein the main heat generating areas of the semiconductor dies are directly coupled to selected balls of the BGA for directly carrying heat from the major heat sources away from the device.