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Method and apparatus for providing shear-induced alignment of nanostructure in thin films

机译:在薄膜中提供剪切诱导的纳米结构取向的方法和装置

摘要

A method and apparatus is disclosed for providing shear-induced alignment of nanostructures, such as spherical nanodomains, self-assembled nanodomains, and particles, in thin films, such as block copolymer (BCP) thin films. A silicon substrate is provided, and a thin film is formed on the substrate. A pad is then applied to the thin film, and optionally, a weight can be positioned on the pad. Optionally, a thin fluid layer can be formed between the pad and the thin film to transmit shear stress to the thin film. The thin film is annealed and the pad slid in a lateral direction with respect to the substrate to impart a shear stress to the thin film during annealing. The shear stress aligns the nanostructures in the thin film. After annealing and application of the shear stress, the pad is removed, and the nanostructures are uniformly aligned.
机译:公开了一种用于在诸如嵌段共聚物(BCP)薄膜的薄膜中提供诸如球形纳米域,自组装纳米域和颗粒之类的纳米结构的剪切诱导排列的方法和设备。提供硅衬底,并且在衬底上形成薄膜。然后将垫施加到薄膜上,并且可选地,可以在垫上放置重物。可选地,可以在垫和薄膜之间形成薄的流体层,以将剪切应力传递到薄膜。使薄膜退火,并使垫相对于基板在横向上滑动,以在退火期间将剪切应力施加至薄膜。剪切应力使薄膜中的纳米结构对齐。在退火和施加剪应力之后,将垫去除,并且将纳米结构均匀地排列。

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