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Semiconductor package, memory card including the same, and mold for fabricating the memory card
Semiconductor package, memory card including the same, and mold for fabricating the memory card
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机译:半导体封装,包括该半导体封装的存储卡以及用于制造该存储卡的模具
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摘要
A semiconductor package includes a printed circuit board, a semiconductor chip mounted on the printed circuit board, a wire structured to electrically connect the printed circuit board to the semiconductor chip, and an encapsulant that protects the semiconductor chip and the wire, the encapsulant disposed on the printed circuit board such that the encapsulant covers a surface of the printed in an edge region of the printed circuit board and exposes another surface of the printed circuit board in another edge region of the printed circuit board.
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