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Methods, apparatus, and systems with semiconductor laser packaging for high modulation bandwidth
Methods, apparatus, and systems with semiconductor laser packaging for high modulation bandwidth
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机译:具有半导体激光器封装以实现高调制带宽的方法,装置和系统
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摘要
Semiconductor packaging methods, systems and apparatus for semiconductor lasers to achieve high modulation bandwidth. Systems, methods and apparatus for minimizing the inductance of wire bond interconnects and impedance matching in a semiconductor laser package. Systems, methods and apparatus for monitoring a photocurrent in order to provide automatic power control (APC) of a semiconductor laser.
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