首页>
外国专利>
Method and structure for self healing cracks in underfill material between an I/C chip and a substrate bonded together with solder balls
Method and structure for self healing cracks in underfill material between an I/C chip and a substrate bonded together with solder balls
展开▼
机译:I / C芯片和用焊球粘结在一起的衬底之间的底部填充材料中的裂缝的自我修复方法和结构
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method of self-healing cracks in a cured epoxy base underfill material between an I/C chip and a substrate is provided. A plurality of capsules is dispersed in the epoxy base. Each capsule has a curable thermosetting adhesive encapsulated in a rupturable shell to disperse the thermosetting adhesive in a crack in the epoxy base when the shell ruptures. Each capsule is less than 25 microns in diameter. A curing agent that will cause a reaction of the thermosetting adhesive on contact is dispersed in the epoxy to form a cured adhesive in a crack in said epoxy base. The shell will rupture when encountering a crack being propagated in the underfill material, which will at least partially fill the crack with the adhesive, and cure the adhesive with the curing agent to bond the edges of the crack together. The invention also includes the structure for crack self-healing.
展开▼