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Method and apparatus for determining burn-in reliability from wafer level burn-in
Method and apparatus for determining burn-in reliability from wafer level burn-in
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机译:从晶片级老化中确定老化可靠性的方法和设备
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摘要
A method and apparatus for determining burn-in reliability from wafer level burn-in are disclosed. The method according to the present invention includes recording the number of failures in each IC die in nonvolatile elements on-chip at points in time over the duration of wafer level burn-in testing. The number of failures in each IC die, along with their associated points in time, may be used to create burn-in reliability curves which are conventionally derived using other processes that may be less cost effective or not possible to effect with unpackaged IC dice. A memory device associated with the method of the present invention is also disclosed.
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