首页> 外国专利> Arrangements of differential pairs in multi-layer printed circuit board for eliminating crosstalk

Arrangements of differential pairs in multi-layer printed circuit board for eliminating crosstalk

机译:多层印刷电路板中用于消除串扰的差分对的布置

摘要

An arrangement of differential pairs in a multi-layer printed circuit board is provided for eliminating crosstalk. The arrangement of differential pairs in the multi-layer printed circuit board includes a first differential pair, and a second differential pair. The first differential pair and the second differential pair may each be a driven pair or a victim pair. By properly arranging the first differential pair and the second differential pair, in accordance with the present invention, the resultant crosstalk on the first differential pair induced by the second differential pair, or vice versa, is substantially zero or negligible.
机译:为了消除串扰,提供了多层印刷电路板上的差分对的布置。多层印刷电路板中的差分对的布置包括第一差分对和第二差分对。第一差分对和第二差分对可以分别是驱动对或受害对。根据本发明,通过适当地布置第一差分对和第二差分对,由第二差分对在第一差分对上引起的串扰基本上为零或可忽略不计。

著录项

  • 公开/公告号US7102455B2

    专利类型

  • 公开/公告日2006-09-05

    原文格式PDF

  • 申请/专利权人 YU HSU LIN;SHANG TSANG YEH;

    申请/专利号US20040783596

  • 发明设计人 YU HSU LIN;SHANG TSANG YEH;

    申请日2004-02-19

  • 分类号H01P3/02;

  • 国家 US

  • 入库时间 2022-08-21 21:41:42

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