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Structure and method of vertical transistor DRAM cell having a low leakage buried strap

机译:具有低泄漏掩埋带的垂直晶体管DRAM单元的结构和方法

摘要

A structure and method is disclosed herein for a vertical transistor DRAM cell having a low leakage buried strap outdiffusion conductively connecting a storage capacitor in a lower portion of a trench to a vertical transistor thereabove. In the disclosed structure and method, the buried strap outdiffusion (BSOD) extends along a portion of the isolation collar having reduced thickness, the reduced thickness being substantially less than the thickness of the isolation collar otherwise. In a particular embodiment, a self-aligned lightly doped drain (LDD) extension is formed, extending between the BSOD and the vertical transistor above the LDD.
机译:本文公开了一种用于垂直晶体管DRAM单元的结构和方法,该垂直晶体管DRAM单元具有低泄漏掩埋带向外扩散,其将沟槽的下部中的存储电容器导电地连接至其上方的垂直晶体管。在所公开的结构和方法中,掩埋带外扩散(BSOD)沿着隔离套环的具有减小的厚度的一部分延伸,否则减小的厚度基本上小于隔离套环的厚度。在特定实施例中,形成自对准轻掺杂漏极(LDD)延伸,其在BSOD与LDD上方的垂直晶体管之间延伸。

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