COVERLAY LAMINATING METHOD AND MACHINE FOR MULTI LAYER TYPE FPCB

摘要

The present invention relates to a coverlay laminating method and apparatus for a multi-layer flexible printed circuit board, wherein a coverlay and a lamination are also rolled in a roll state of a copper foil circuit board on which a circuit pattern is formed by a roll-to-roll method in a roll state. After cutting, the cutting can be automatically performed, thereby preventing the defect caused by the substrate bending or the foreign matter in the coverlay welding process, thereby greatly improving the productivity.;The present invention for realizing this is carried out in a roll-to-roll method, in which the coverlay is welded to a copper foil circuit board on which a circuit pattern is formed through exposure, development, etching, and peeling processes, and thus, each coiler having a different height is in a roll state. A loading step of loading the copper foil circuit board and the coverlay, respectively; A laminating step of bringing the copper foil circuit board and the coverlay conveyed from the coilers at a constant speed into close contact with each other through a high temperature hot roller; A tension maintaining step of maintaining a constant tension in the path transferred to the close state; A cutting step of recognizing the sensing mark of the copper foil circuit board as a camera and cutting it to a predetermined size in the process of being transferred; It characterized in that it has a manufacturing process and the apparatus comprising a; unloading step of vacuum-stacking the coverlay temporary circuit board made of the cutting by sequentially stacking.;Flexible PCB, FPCB, Coverlay, Welded, Roll to Roll