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COMPOSITION FOR CLEANING ETCH RESIDUE AND CLEANING METHOD OF USING THE SAME

机译:清洗残留物的组成和使用该残留物的清洗方法

摘要

The present invention relates to an etching residue cleaning composition and a cleaning method using the same, and more particularly, to an etching residue cleaning composition comprising sulfuric acid, an oxidizing agent and deionized water, and optionally ammonium fluoride, and the composition comprising a substrate Or a cleaning method for contacting a semiconductor device structure to remove etching residues present on the substrate or structure. When the cleaning composition according to the present invention is used, various kinds of etching residues present on various substrates or semiconductor device structures can be efficiently removed without damaging metal wiring such as aluminum, and thus, high density It can be advantageously used to remove etching residues occurring on a substrate or semiconductor structure in the manufacture of multilayer semiconductor devices.;Etch Residue Cleaner
机译:蚀刻残留物清洁组合物及其使用的清洁方法技术领域本发明涉及一种蚀刻残留物清洁组合物及其使用的清洁方法,更具体地,涉及一种包含硫酸,氧化剂和去离子水以及任选地氟化铵的蚀刻残留物清洁组合物,以及包括基材的组合物。或者一种用于接触半导体器件结构以去除存在于基板或结构上的蚀刻残留物的清洁方法。当使用根据本发明的清洁组合物时,可以有效地去除存在于各种基板或半导体器件结构上的各种蚀刻残留物,而不会损坏诸如铝的金属布线,因此,高密度可以有利地用于去除蚀刻。多层半导体器件制造中残留在基板或半导体结构上的残留物;蚀刻残留清洁剂

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