首页> 外国专利> FRAME FOR CHIP INDUCTOR, THE FRAME MAKING METHOD AND THE CHIP INDUCTOR MAKING METHOD USING THE SAME

FRAME FOR CHIP INDUCTOR, THE FRAME MAKING METHOD AND THE CHIP INDUCTOR MAKING METHOD USING THE SAME

机译:芯片电感的框架,框架的制作方法以及使用该框架的芯片电感的制作方法

摘要

Chip Inductors for manufacturing the frame , the frame and method of manufacturing a chip inductor manufacturing method using the frame is started . As disclosed for producing a chip inductor body frame is a frame , with one set of plate-like terminals to be continuously formed on the frame body , wherein the insertion piece is inserted and which is bent to form a hole in the end of each plate-like terminals , which are provided for bending one end of the insertion convenience piercing and complementary , with a cutting part that is bored in the frame body in order to divide the respective plate-shaped terminal , and includes index holes formed symmetrically on both sides of the frame body for the correct positioning of each of the plate-like terminals . According to this configuration, when the insertion piece of the core assembly of the lead can be prevented and the separation of the lead -line , it is possible to maximize the productivity of a chip inductor .
机译:开始了用于制造框架的片状电感器,框架以及使用该框架的片状电感器的制造方法。如用于制造芯片电感器主体的框架所公开的是一种框架,其具有一组要连续形成在框架主体上的板状端子,其中插入件被插入并且弯曲成在每个板的端部中形成孔。状端子,其用于使插入方便性的一端弯曲并互补,并具有在框架主体上钻孔以划分各个板状端子的切割部,并且包括在两侧对称地形成的分度孔为了正确定位每个板状端子,请使用框架本体的“ A”字形。根据该构造,当可以防止引线的芯组件的插入件和引线的分离时,可以最大化片式电感器的生产率。

著录项

  • 公开/公告号KR100545528B1

    专利类型

  • 公开/公告日2006-01-24

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20040031453

  • 发明设计人 김사문;양문식;

    申请日2004-05-04

  • 分类号H01F41/02;

  • 国家 KR

  • 入库时间 2022-08-21 21:24:23

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