首页>
外国专利>
METHOD OF PREPARING AN ELECTRONIC PACKAGE BY CO-CURING ADHESIVE AND ENCAPSULANT
METHOD OF PREPARING AN ELECTRONIC PACKAGE BY CO-CURING ADHESIVE AND ENCAPSULANT
展开▼
机译:胶粘剂和胶粘剂共制备电子包装的方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
A semi-conductor package in which an integrated circuit chip is connected to a substrate using wire-bonding is prepared by curing the die attach adhesive and encapsulating the wire bonds in one heating step. The encapsulant composition has a curing chemistry and a curing profile compatible with those of the adhesive.
展开▼